Teardown process
- Tool access
- Special tools requirements
- Teardown photography
- Components photography
- Weight details
- Data collections & BOM creation
Components detail in control units
- Electronic components (capacitor, microprocessor, insulator, sensors, etc.) like in the devices counts, types, ratings, measurements are collected
Data sheets of the microprocessor
- What type of Microprocessor is used in the PCB and its data sheets are collected for studies
Bom of the control units
- PCB LWH measurements, thickness, weight details are collected for studies.
Connector details of the control units
- Details of pin count in PCB, pin type and its material, connector type, cable type, pin count (flexible flat cable), connector material, insulator used in the connector.